Meister
World-Best Advanced IC Packaging Inspection
- · The world's most advanced IC packaging process optimization solution
- - Industry leading measurement accuracy and inspection reliability
- - Provides high-resolution review
- - Applicable packaging: SiP, 2.5D, 3D, 3D WLP, WL CSP, FO WLP, FC BGA, MCM
- - Handling media: Laminate Substrate, Metal Carrier, Strip on Boat, Mylar Frame
- · Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory
- - Real-time process optimization through powerful SPC analytics
- - Efficient process management through convenient software
