Koh Young Technology to Exhibit at SMT Hybrid Packaging 20182018-05-14
Seoul, South Korea, May 14, 2018 - Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled to take place June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation premium Zenith2 3D AOI, new 3D Pin inspector KY-P3, and the new automated solder dispensing feature on its 3D SPI.
Latest AOI System
At the show, Koh Young will exhibit Zenith2 3D AOI, which inspects a wide range of mounted components and chips with side-view camera solutions. Zneith2 is the next-generation 3D AOI platform of Zenith series, which recently earned SMT China VISION Award for its innovativeness. This user-friendly, smart 3D AOI was designed according the latest Industry 4.0 with new features. New features include Auto Programming which automatically sets up inspection conditions, yielding a 70% reduction in programming time, OPO@KSMART (Offline Program Optimizer) to automatically deploy modified inspection conditions without stopping the line.
3D SPI with Auto-Repair
Koh Young will also display enhanced 3D SPI systems with automated solder paste dispensing named Auto-Repair. The high-precision, user-friendly dispensing system helps to eliminate costly mistakes due in large part to insufficient solder in open joints, lean fillets, and weak joints. The KY8030-3 not only inspects solder paste with the highest possible speed and precision, but it repairs insufficient solder defects before pass through, resulting enhanced first pass yield and reduces operational costs.
Leveraging its core strengths in robotics and 3D measurement, Koh Young will also highlight the new KY-P3 inspection solution. Koh Young’s KY-P3 allow check a wide range of pins, including single pin, press-fit, forkpin, pins into chamber (ECU), are correctly aligned with the designated through holes in the circuit board. Thanks to Koh Young’s superior 3D imaging technology, it measures the pin height with ±0.75% height accuracy based on Koh Young calibration targets.
As the absolute leader in the SPI and AOI market, Koh Young at Booth 233 in hall 4A, you can learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com