Press Release

Koh Young Technology Shows Latest true 3D innovations at electronica


Alzenau, Germany – Koh Young Technology, the leading 3D measurement inspection solutions will exhibit at electronica 2018, the world’s largest trade fair and conference for electronics, taking place November 13 to 16 at the Munich Trade Fair Centre in Munich, Germany. At the event, Koh Young will be showcasing its AI-driven 3D inspection systems like Zenith 2 as well as new pin inspection system in hall A3, booth 358. Customers can experience the thorough technical support of Koh Young Technology, which has sold over 13,000 machines and served over 1,900 global customers throughout the world.

3D AOIs get simpler and better

At the show, Koh Young Technology will showcase the next-generation 3D AOI Zenith 2 and high-speed 3D AOI Zenith UHS system. Not only these systems inspect all objects on whole PCB surface for 100 percent inspection coverage, they both offer simple, fast programming with AI-driven Auto programming, which reduces job preparation by up to 70 percent. The software develops automated package registration and inspection condition settings, which ensures easier programming based on 3D measurement and intelligent analysis.

Moreover, the new Zenith 2 further enhances the defect identification capabilities across a wide range of components including leadless chips, connectors, SOJs, as well as partially shielded components with the help of side-view solution. The company recently delivered its 13,000th machine, Zenith 2 3D AOI, to wenglor sensoric GmbH in Germany.

Premium 3D AOI

The company will also display the all-new premium 3D SPI aSPIre 3. The aSPIre3 SPI solution combines multi-projection moire technology with full 3D data-based process, providing accurate inspection data with real-time PCB warp compensation. The aSPIre 3 system has superior accuracy with 01005 inspection capacity gage r&R <10% (at 6 sigma) and is also 2 times faster than its predecessor. Moreover, with Industry 4.0 solutions like Link@KSMART, users can consider a clear link between quality of the paste deposit at the component level and the quality of the soldering process by comparing SPI, AOI results.

New Inspection System

Koh Young will also show the new KY-P3 pin inspection solution, which delivers true 3D inspection data for single array, fork pin, press-fit and more pin configurations. The new KY-P3 inspection solution guarantees the drastic false call reduction and eliminates escapes with consistent performance in measurement and inspection process. Auto programming is also available to enable fast inspection condition setting and modification based on newly constructed AI engine.

At the event, visitors may talk to its technical experts about how Koh Young Technology can help bring your innovative ideas into reality with the true 3D measurement-based technology while keep improving your process. Visit Koh Young at Hall A3, booth 358 to explore the possibilities.

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