At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.

During the exhibition, Koh Young will exhibition eight products that solve electronics assembly challenges:

1.     KY8030-3: The Industry’s Fastest True 3D Solder Paste Inspection Solution

A.    Automated Solder Paste Dispensing: The KY8030-3 automatically dispenses paste with its Auto-Rework option. The high-precision and user-friendly dispensing system eliminates costly mistakes due to insufficient solder causing open joints, lean fillets, and weak joints.

B.    Review 3.0: Provides intuitive review and verification station.

2.     Zenith F: The Industry’s Best-in-Class True 3D AOI Solution for FPCB Assembly

A.    FPCB Substrate Handling: The Zenith F is the ideal solution for high-volume FPCB inspection. Due to the thinner and pliable nature of the flexible printed circuit boards, special handling with dedicated expertise is required in comparison to traditional printed circuit boards.

B.    Hotbar Inspection: The Zenith F is the industry’s only solution to base its inspection criteria on the IPC-610 standards using True 3D inspection performance for hotbar soldering.

3.     Zenith Alpha: The Best Value 3D Automated Optical Inspection Solution

A.    KAP (Koh Young Auto Programming): The innovative geometry-based KAP software solution reduces the programming process to minimize time to production and reduces costs.

B.    Whole-board Foreign Material Inspection (WFMI): Inspection goes beyond components and solder joints. The Zenith Alpha combines 2D with True 3D to identify foreign material such as burr, solder balls, chips, and other debris that may lead to costly field failures.

4.     Meister S: Premium In-line 3D Inspection System for “Micro-Thin” Solder Paste

A.    Flux Inspection: Combining innovative vision algorithms and high-resolution optics for the semiconductor industries, the Meister S is a solution provider for flux inspection.

B.    Thin Solder Inspection: The Meister S has been qualitied for mass production by major semiconductor foundries and micro-LED companies for solder inspection down to 10um.

5.     Meister D: Industry’s Leading Inspection System for Advanced Packaging

A.    Crack Inspection: The Meister D is a solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign material, and more.

6.     Neptune C+: Revolutionary True 3D In-line Dispensing Process Inspection (DPI) Solution

A.    True 3D Profiling: Using patented technologies, the Neptune C+ is the industry’s first 3D inline DPI and thickness measurement solution for transparent material inspection. The system allows manufacturers to explore the depths of its process and accurately find defects with 2D, 3D, and cross-section views.

B.    Bubble Inspection using AI-Powered Capabilities: With its proprietary machine learning technology, the Neptune C+ offers enhanced inspection capabilities enabling autonomous bubble inspection without teaching and endless tuning.

7.     KY-P3: Breakthrough in 3D Automated Pin Inspection Solutions

A.    Versatile Handling Mechanisms: Handling products at the back-end process has proven to be a challenge, yet Koh Young provides a perfect product lineup with versatile handling mechanisms. It offers multiple board and carrier handling solutions to accommodate multiple types of PCBs, connectors, terminals, and even final assemblies with housing pins.

8.     KSMART Solutions: True Smart Factory Solution

A.    Turn Data into Insight: AI-powered KSMART solutions help automate process control while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve metrics, increase quality, and lower costs by eliminating variances, false calls, and escapes.

                        i.         Convert data into knowledge for effective and quality-driven actions

                       ii.         Deliver an AI-powered process analysis and optimization tool

                      iii.         Achieve an autonomous process optimization facility