World-Best Advanced IC Packaging Inspection

· The world's most advanced IC packaging process optimization solution
- Industry leading measurement accuracy and inspection reliability
- Provides high-resolution review
- Applicable packaging: SiP, 2.5D, 3D, 3D WLP, WL CSP, FO WLP, FC BGA, MCM
- Handling media: Laminate Substrate, Metal Carrier, Strip on Boat, Mylar Frame
· Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory
- Real-time process optimization through powerful SPC analytics
- Efficient process management through convenient software